ADTEC Engineering EnglishChineseKorean
HomeContact UsSite Map
Product OverviewsSupportAbout Us
Home >> Event Information >> JPCA Show 2014 Event report
Announcement List

Event Information

JPCA Show 2014 Event Report
Mount, Connect, Manufacture, and Expand

The Japan Electronics Packaging and Circuits Association held its JPCA Show.

Period: Wednesday, June 4 - Friday, June 6, 2014
Venue: Tokyo Big Sight
Attendance: 119,220 (total for 3 days)

Overview of entire venue

The JPCA Show, the world’s largest exhibition for printed circuit boards, attracts large numbers of visitors each year. Although the latter half of this year’s show was marred by rain, there was a slight increase in overall attendance over last year, and the hall was bustling with visitors from Japan and overseas.
This year, ADTEC opened a booth along with parent company Ushio Inc. Our exhibitions featured our High-Resolution Direct Imaging Exposure System, targeted for next-generation package substrates, and our High-Productivity Direct Imaging Exposure System, featuring the actual system in the booth. We also demonstrated our industry-recognized Contact Exposure System for solder resist applications, attracting many visitors. And with our NPI Presentations for these equipments, our exhibition gained widespread attention from attendants.

About the JPCA Show
  • High-Resolution, High-Productivity Direct Imaging Exposure System INPREX Series
  • High-Quality Contact Exposure System ADEX Series
  • NPI Presentation: Outlook for Direct Imaging Exposure Systems

Next Exhibition Schedule

Period: Wednesday, June 3 Friday, June 5, 2015
Venue: Tokyo Big Sight East Exhibition Hall