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ADTEC will be participating in NEIA Electronica Niigata 2022
ADTEC will be exhibiting at SEMICON Japan 2022/APCS (Advanced Packaging and Chiplet Summit)
ADTEC will be participating in JPCA SHOW 2022
ADTEC will be participating in JPCA SHOW 2021
Notice of opening of Omiya Technical Center
Direct Imaging Exposure system for FO package of cutting edge semiconductor and Organic package substrate(advanced BGA)
Notice of "Expansion of Production Capacity" at the Nagaoka Plant
Notice of office and factory closure during new year holidays
ADTEC Partners with Deca to Enhance Adaptive Patterning™ for 2µm Chiplet Scaling
Notification of Headquarters Relocation