H1

History

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Company History

Product & Technology History

1980

1983: ADTEC Engineering Co., Ltd. Established

1983

  • Started Manufacturing Semiconductor-Related Equipment

1984

  • Opened a Plant in Nagaoka City, Niigata Prefecture (Currently Fab D)

1985

  • Started Production of Molds for Resin Molding

1986

  • Released the FP3000 Lead Scanner, a Semiconductor Inspection Equipment

1988

  • Released the Video Magnetic Head Manufacturing Equipment

1989

  • Established ADTEC Service Co., Ltd. in Nagaoka City, Niigata Prefecture

1990

1990

  • Released the LCD Inspection Equipment

1991

  • Released the Exposure Systems AC400
  • Developed a Pressure Contact Method

1993

  • Released the LCD Pattern Inspection Equipment LPC-500
  • Developed a Cover Film Peeling Mechanism

1994

  • Absorbed ADTEC Service Co., Ltd.

1997

  • Relocated Head Office to Shiba Park, Minato-ku, Tokyo

1999

  • Acquired ISO 9001 Certification

2000

2001

  • Released the Projection Exposure Systems APEXS2031

2003

  • Released the ANEX Series Exposure Systems

2004

  • Launched Remote Service System
  • Released the ADEX Series Exposure Systems

2006

  • Acquired ISO 14001 Certification
  • Revamped Corporate Logo
  • Relocated Head Office to Toranomon, Minato-ku, Tokyo
  • Started Operations of the Second Plant at Nagaoka(currently Fab A)
  • Listed on JASDAQ

2008

  • Formed a Business Alliance with Fujifilm Corporation for Manufacturing and Sales of Digital Exposure Systems

2008

  • Started Manufacturing the INPREX Series Digital Exposure Systems

2010

2010

  • Formed a Capital and Business Alliance with Ushio Inc.

2014

  • Acquired the Digital Exposure Systems Business from Fujifilm Corporation
  • Became a Wholly Owned Subsidiary of Ushio Inc. and Delisted from JASDAQ

2016

  • Relocated Head Office to Marunouchi, Chiyoda-ku, Tokyo

2016

  • Released the IP-6 Series Digital Exposure Systems

2018

  • Acquired the Exposure Systems Business from Via Mechanics, Ltd.
  • Opened the Yokohama Technical Center in Yokohama City, Kanagawa Prefecture

2019

  • Released the IP-4 Series Digital Exposure Systems

2020

2020

  • Relocated Head Office to Toranomon, Minato-ku, Tokyo
  • Announced Collaboration with Deca Technologies on Adaptive Patterning™

2020

  • Released the IP-15UHT (Twin Stage Model) Digital Exposure Systems

2021

  • Released the Direct Imaging Exposure Systems DE-2 W300 for WLP (Wafer-Level Packaging)

2021

  • Started Operations of Fab B at Nagaoka Plant
  • Transferred the Solar Simulator Business from Wacom Denso Co., Ltd.
  • Opened the Omiya Technical Center in Saitama City, Saitama Prefecture

2023

  • Started Operations of Fab C at Nagaoka Plant
  • Acquired Shares of YANAKA Holdings Co., Ltd. (currently YANAKA ADTEC Precision Co., Ltd.)