Creating the Future Through Groundbreaking Core Technologies
We are actively pursuing the development of groundbreaking core technologies in anticipation of next-generation semiconductor packaging equipment, where even greater precision and speed are essential. Led by our Future Technology Creation Team (FTCT), we collaborate with numerous partner companies, universities, and experts to explore and develop new elemental technologies beyond the extension of existing methods through open innovation.
Core Technologies
Laser Processing Solutions
In response to the rapidly expanding applications of laser processing technology and the growing demands for improved precision and productivity, we are actively engaged in developing new technologies.
CFRP Solutions
Amid the increasing demand for both productivity and high precision in industrial equipment, we have focused on CFRP materials, known for their lightweight and high rigidity characteristics, and developed ultra-lightweight, high-rigidity honeycomb panels. (Patented)
CFRP offers excellent thermal dimensional stability due to its low coefficient of thermal expansion. We have independently developed a CFRP material with nearly zero thermal expansion by combining CFRP with a negative coefficient of thermal expansion and materials with a positive coefficient of thermal expansion, creating a hybrid material. This allows for the suppression of accuracy fluctuations caused by temperature changes.
Sensing Solutions
We are developing optical systems technology capable of achieving submicron precision. Light from the light source passes through a patented optical system and is captured by a high-precision CCD. Using our proprietary position detection algorithm, we define and propose highly accurate straightness standards.
Using EFPI sensors, which offer superior precision and long-term stability, we measure the thermal strain of the equipment structure online and perform position correction to achieve high-precision positioning accuracy.
Industry-Academia Collaborative Research
We collaborate with leading engineering manufacturers and renowned university research labs in the fields of cutting-edge laser microfabrication equipment and material layering technology. As part of this effort, we have partnered with the Koseki & Ohnishi Laboratory at the Hongo Campus of the University of Tokyo, where we have established an Element Development Lab within their experimental facilities. This lab is dedicated to the development and practical application of new technologies, driving future technological innovations.