INPREX PKG system by direct imaging exposure system

It is widely used not only for print panel, but also for the production of core panel and build-up panel of substrates, which require higher precision at higher positions, and for forming Bump joints.
Applications: High-performance IC packaging: Forming circuitry such as panel
・FC-BGA panel
・FC-CSP
・Modular panel for AiP, etc.

IP-4 V2 / IP-6 SW / IP-6 UH / IP-8 UH / IP-10 UH

One-time scan/direct exposure
Equipped with a new drawing engine that integrates advanced lens design technology into the original laser unit. High-quality, high-power laser heads are lined up with a panel width. This enables one-time scanning.
High-quality exposure without head-to-head connection or misalignment is realized.