Direct Imaging Exposure System DE

This is Direct-imaging exposure systems for advanced semiconductor FO packages and organic package substrates (advanced BGA).

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"DE-2 W300," a direct-imaging exposure system for WLP (Wafer-Level Packaging) manufacturing for advanced semiconductor FO packages and organic package substrates (advanced BGA), and "DE-2 P600," a direct-imaging exposure system for PLP (Panel-Level Packaging).
 
By adopting a high-precision stage and achieving an overlay of ±1μm along with a cutting-edge optical system capable of L/S: 2/2μm, we have realized the high precision and high resolution required for the production of advanced semiconductor FO packages and organic package substrates. Integration with Deca Technologies' Adaptive Patterning™ enables compatibility with multi-chip FO as well.

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