H1

Alignment marking equipment

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製品詳細・英
PCB Manufactur​ing Equipment

Model

AMRK1000 / AMRK2000(Large Size)

Features

Reduces the standard hole machining (through hole) process of the inner layer panel.

Introduction Examples

・UV exposure is applied to DFR (dry film resist) laminated on panel by connecting it to the exposure unit. Form a reference mark.
・It is possible to form a total of four marks on the front and back sides of two places on panel surface.
Standard hole process efficiency
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