This device automatically peels off the polyester cover film attached to the surface of the dry film photoresist on the unprocessed printed circuit board. After peeling, it supplies the circuit board to the developing unit.
[Clean Peel-Off]
・By using adhesive rollers instead of air blowers for peeling, chip detachment is greatly reduced.
・Downflow with a HEPA filter is also possible (optional).
[No Setup Required (Simplified)]
・No setup change is required for different board thicknesses and sizes.Board size: 300 x 250 ~ 650 x 650 mm
・Boards that fail the peeling process are stacked in an NG stocker, with a capacity of up to four boards.
・Equipped with an ultrasonic sensor, it reliably detects whether the film has been peeled off.
[Compatible with Ultra-Thin Boards]
・Supports board thicknesses from 0.025 mm to 3.2 mm.
・The installation of a lateral knurling mechanism makes peeling easier.
・The edges of the board on the input side are gripped by a mechanical chuck, preventing the issue of thin boards being caught by the adhesive roller, which has been a problem in the past.
・Stable transport is achieved by reducing the roller pitch.